http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2003268199-A
Outgoing Links
Predicate | Object |
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assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_129e393582e6bdf4029baf2206522f45 |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L33-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-24 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-62 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L101-02 |
filingDate | 2002-03-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c23ffa8aaf42846544ab63b214effbc0 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3e851e20add99f1617a784a909909710 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9b9c07d6d42728a4e4f19515ba5b7ccd |
publicationDate | 2003-09-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | JP-2003268199-A |
titleOfInvention | Epoxy resin composition and semiconductor device |
abstract | (57) [Problem] To provide an epoxy resin composition for semiconductor encapsulation excellent in reflow resistance and low void resistance, and to provide a semiconductor device encapsulated with the epoxy resin composition. An epoxy resin composition containing an epoxy resin (A), a curing agent (B), and a filler (C), wherein the epoxy resin composition has a specific chemical formula (I) as an essential component. An epoxy resin composition for encapsulating a semiconductor, comprising one or more resins having the following structure: Further, the above epoxy resin composition for semiconductor encapsulation, wherein the structure of the formula (I) is a specific acrylate ester, is preferable. |
priorityDate | 2002-03-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 98.