http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2003268196-A

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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L61-06
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filingDate 2002-03-19-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0e6ef7d82297468b51a59035b797252d
publicationDate 2003-09-25-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2003268196-A
titleOfInvention Phenolic resin molding compound for commutator
abstract (57) [Problem] To provide a phenol resin molding material for a commutator having improved mechanical strength and excellent heat resistance and moisture resistance. SOLUTION: This is a phenol resin molding material for a commutator containing a novolak type phenol resin using an organic phosphonic acid as a catalyst, hexamethylenetetramine as a curing agent, and an inorganic base material containing glass fiber. On the other hand, the novolak type phenol resin is 25 to 40% by weight, hexamethylenetetramine is 3 to 10% by weight, and the inorganic base material is 55% by weight. 7070% by weight.
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Total number of triples: 25.