| abstract |
(57) [Summary] [Problem] To provide a thermosetting resin cured product having improved thermal conductivity while maintaining substantially isotropic spatially. The cured thermosetting resin of the present invention has an anisotropic structure in a resin component contained in the cured thermosetting resin, and an anisotropic structural unit constituting the anisotropic structure is included. It has a covalent bond, and the maximum value of the diameter of the anisotropic structural unit is 400 nm As described above, the ratio of the anisotropic structure contained in the resin component was 25 vo. 1% or more, containing 20 vol% or more of metal or inorganic ceramic filler powder having a thermal conductivity of 5 W / m ยท K or more. |