http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2003264125-A
Outgoing Links
Predicate | Object |
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assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_d5d04736b0b882a4f5a1e0e0e4cd8cbb |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01G9-012 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01G9-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01G9-04 |
filingDate | 2003-02-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_37e9790633fbdb9c6044bc4c3762ea9a http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_de331036700da249c2c87e20ec00d205 |
publicationDate | 2003-09-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | JP-2003264125-A |
titleOfInvention | Chip-shaped solid electrolytic capacitor |
abstract | [PROBLEMS] To connect a capacitor element and a convex portion of a lead frame at different heights, but to prevent the anode substrate from bending, provide a step in the convex portion of the lead frame to curve the anode substrate. To relax. Provided is a chip-shaped solid electrolytic capacitor which is inexpensive and has a good leakage current value without manufacturing an expensive mold for this purpose. SOLUTION: An anode substrate made of a valve-shaped metal having a dielectric oxide film layer on the surface, an anode portion at an end thereof, a semiconductor layer on the dielectric oxide film layer at the remaining portion of the anode substrate, A solid electrolytic capacitor element provided with a conductor layer in order is connected to a lead frame, and a chip-shaped solid electrolytic capacitor sealed with an exterior resin except for a part of the lead frame. A chip-shaped solid electrolytic capacitor having an anode connected to the anode side of a lead frame via a metal wire. |
priorityDate | 2003-02-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 30.