http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2003262955-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_097405822d505467fd50f7100022cd56 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-40 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-038 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-027 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-004 |
| filingDate | 2002-03-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_14aa0fe55df5d5b879846e99eb958420 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_02ab9b8b0c47e63e95b11c9ba07407ba http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1885cf38edb327c54fea8c70e008395a |
| publicationDate | 2003-09-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2003262955-A |
| titleOfInvention | Curable composition for etching resist |
| abstract | (57) Abstract: A curable composition for an etching resist, particularly a shadow mask, which is excellent in curability and whose cured film is excellent in transportability, etching resistance and alkali dissolution / peelability even at a high etching temperature. Provided is a composition useful as a composition for a backing material during production. Kind Code: A1 Tan δ (E ″ / E ″) is a ratio of storage elastic modulus (E ′) and loss elastic modulus (E ″) in dynamic viscoelasticity of a cured product. E ′) is in the range of 50 to 80 ° C., and tan δ Curable composition for etching resist having a value of 0.4 or more. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2006045316-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-4517229-B2 |
| priorityDate | 2002-03-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 180.