http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2003257813-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_f4a8faea375370b67c9d71e67db32bcd |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-027 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-205 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05B3-20 |
| filingDate | 2002-02-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_06ddbade249c18a4e8ef4228cfdb0ddd |
| publicationDate | 2003-09-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2003257813-A |
| titleOfInvention | Wafer heating device |
| abstract | (57) [Summary] In a temperature measuring element used for adjusting the temperature of a heat equalizing plate in a wafer heating apparatus, how to reduce the variation in the measured temperature of each temperature measuring element is a problem in temperature control. Had become. A heating resistor is formed on the surface or inside of a ceramic plate, and a concave portion is provided from a side opposite to a heating surface for heating an object to be heated toward the heating surface. In the wafer heating apparatus provided with the above thermocouple, the diffusion layer at the temperature measuring contact portion of the thermocouple is set to 0.5 to 10 times the wire diameter. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I381422-B http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-111528529-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2010147057-A1 |
| priorityDate | 2002-02-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 22.