| abstract |
PROBLEM TO BE SOLVED: To maintain processability by maintaining solubility in an organic solvent, to improve heat resistance after ring closure as a usage form, and to obtain electrical, physical and mechanical properties. Provided are a precursor, a heat-resistant resin, an insulating film, and a semiconductor device which have excellent characteristics and provide a heat-resistant resin suitable for applications such as an interlayer insulating film of a semiconductor. SOLUTION: A polybenzoxazole resin precursor having a specific structure having a carboxylic acid or carboxylic ester group in a molecule, and a polybenzoxazole resin precursor obtained through a condensation reaction and / or a crosslinking reaction and a decomposition reaction. A semiconductor device includes a polybenzoxazole resin, an insulating film containing the polybenzoxazole resin, and an interlayer insulating film for multilayer wiring and a surface protective film including the insulating film. |