| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_20d3042eb4ea7c9afd525aa89373349d |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-32
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-24
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03 |
| filingDate |
2002-02-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_93058b3b5fe1293015865fa09e24219e
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_87b99267f268944f21d923986e01fb50
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8b280d12b47fcbcbafa354dd7a30f84c |
| publicationDate |
2003-09-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2003252953-A |
| titleOfInvention |
Epoxy resin composition and cured product thereof. |
| abstract |
(57) [Problem] To provide an epoxy resin composition having excellent heat resistance and moisture resistance which is extremely useful as an epoxy resin material in the field of electronic materials such as high-quality semiconductor encapsulating materials and printed wiring boards. An epoxy resin composition comprising an epoxy resin and a curing agent as essential components, wherein the epoxy resin comprises: Polyhydroxy compound having a structure in which two benzene rings having two hydroxyl groups and three substituents which may be different from each other are bonded via a divalent hydrocarbon group having 4 or more carbon atoms An epoxy resin composition characterized in that it is an epoxy resin derived from and epihalohydrin. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10703855-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2018047724-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-6350891-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101981440-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20180102692-A |
| priorityDate |
2002-02-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |