http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2003249508-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_7acd9416af412b5972feb55a5e652ea2 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-56 |
| filingDate | 2002-02-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_33d463f136a50ec647f74657f9b81b59 |
| publicationDate | 2003-09-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2003249508-A |
| titleOfInvention | Semiconductor device manufacturing method and semiconductor device |
| abstract | (57) Abstract: A method of manufacturing a semiconductor device capable of reducing a warp or the like of a wiring board on which electronic components are mounted, and a semiconductor device manufactured by the manufacturing method. SOLUTION: A semiconductor element 3a is mounted on a wiring board 4a, and a mask 2a is placed on the wiring board 4a such that the semiconductor element 3a is positioned inside an opening 1a. Is printed in the opening 1a by the squeegee 6, In a method for manufacturing a semiconductor device comprising a step of printing and sealing on a wiring board 4a, at least the sealing material 5a is Since the liquid epoxy resin composition is obtained by mixing an epoxy resin, a curing agent, and a plate-like inorganic filler, after the liquid epoxy resin composition is cured, the warpage of the wiring board related to the printing and sealing of the manufactured semiconductor device. Can be reduced. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20170061655-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101979499-B1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2017132858-A |
| priorityDate | 2002-02-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 34.