http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2003248320-A
Outgoing Links
Predicate | Object |
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assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_47cc435e1d443f13180f7766df104d9d |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-11 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-027 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-004 |
filingDate | 2003-01-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f98f95c481c61f2ee76a4d959889b0bd http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e49137bd903cbc5b1a56d6650d49a286 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e03ec4b8fa7ff591a364fbc9841dd25f http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_92ef550662812229f8feb256dce38c2f |
publicationDate | 2003-09-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | JP-2003248320-A |
titleOfInvention | Photosensitive element, method for producing resist pattern using the same, method for producing printed wiring board, and method for producing lead frame |
abstract | PROBLEM TO BE SOLVED: To provide a photosensitive element, a method for producing a resist pattern, and a printed wiring having the resist pattern, which can be laminated with a high yield, and have extremely excellent peeling properties, laminability, storage stability and workability. Provided is a method for manufacturing a plate or a lead frame. SOLUTION: In a photosensitive element comprising a support film (a), a photosensitive resin composition layer (b) and a protective film (c), the photosensitive resin composition layer (b) has (A) a weight average molecular weight. The binder polymer having a molecular weight of 20,000 to 200,000, the concentration of the polymerizable ethylenically unsaturated group (B) being 100 g in total of the components (A) and (B) Of a fisheye having a diameter of 80 μm or more contained in the protective film (c), containing 0.12 to 0.26 mol of a photopolymerizable compound and (C) a photopolymerization initiator. The number is 5 / m 2 or less. This element is laminated on the circuit-forming substrate so that (b) is in close contact, the exposed portion is photo-cured, and the unexposed portion is removed by development. |
isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-WO2009123096-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2009116078-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7662540-B2 |
priorityDate | 1999-03-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 190.