http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2003246839-A

Outgoing Links

Predicate Object
assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_7acd9416af412b5972feb55a5e652ea2
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-62
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-32
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-544
filingDate 2002-02-25-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a248e9ac1fda821c61ad943941740c5d
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f3a7221bd7de222afd41a83c6b0357ec
publicationDate 2003-09-05-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2003246839-A
titleOfInvention Epoxy resin composition for sealing and single-sided sealing type semiconductor device
abstract (57) [Summary] [PROBLEMS] To suppress package warpage during semiconductor encapsulation and to improve reflow resistance by improving adhesion to an interposer, particularly suitable for encapsulation of single-sided encapsulation type semiconductor devices. The present invention provides an epoxy resin composition for sealing which can be used for: SOLUTION: The following structural formula (A- It contains at least one of those shown in 1) and (A-2). It contains a phenol novolak resin having a structure represented by the following structural formula (B) and having a binuclear content of 10% by mass or less as a curing agent. Embedded image
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2019176554-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2011189432-A1
priorityDate 2002-02-25-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

Predicate Subject
isDiscussedBy http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID415744893
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID415777387
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID7681
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419474448
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID12749
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID454473390
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419518007
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID414871446
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID10614
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419526217
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID8934
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID452244850
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID414972214
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419518977
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID458393640
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID425042019
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID83648
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID996
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID68983
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID164912
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID162087478
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID425334797
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID458393636
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID456028012
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID9831062
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID458392451
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID335
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID69591
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID70012
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID412798128

Total number of triples: 49.