http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2003243809-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_f4a8faea375370b67c9d71e67db32bcd |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-15192 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-15153 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01327 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-16251 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01322 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16225 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-09 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-24 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-18 |
| filingDate | 2002-02-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2e03a61e2ac39236c67b3b14ffaa6e25 |
| publicationDate | 2003-08-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2003243809-A |
| titleOfInvention | Wiring board and method of manufacturing the same |
| abstract | (57) [Problem] To provide a wiring board which does not contain lead in a plated metal layer, does not cause functional defects such as spot-like discoloration, and has high solder mounting reliability. Provided is a wiring board that does not harm the device. SOLUTION: The wiring board 4 is formed by forming a wiring conductor 2 made of a high melting point metal on an insulator 1 and applying an electroless plating metal layer 6 on a surface of the wiring conductor 2, the electroless plating metal layer being provided. Reference numeral 6 is characterized in that it contains a Group IB element 8 as metal particles therein and contains no lead, and the particle size of the metal particles of the Group IB element 8 is 0.05 to 0.5 μm. . Since it does not contain lead, it does not cause harm to the human body, and the particle size of the metal particles of Group IB element 8 is appropriately reduced to 0.05 to 0.5 μm. do not do. |
| priorityDate | 2002-02-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 48.