| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_be055db3c1a09879df07379ba969e223 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-83192
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-45144
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01079
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01078
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-1134 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-60 |
| filingDate |
2002-02-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2e77fe40bb247876551afc908b86b942
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0be196b72873eb58910f15186cf31fb1 |
| publicationDate |
2003-08-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2003243447-A |
| titleOfInvention |
Semiconductor element mounting method |
| abstract |
(57) Abstract: An object of the present invention is to provide a mounting method in which a semiconductor element can be flip-chip mounted with reduced equipment cost and with which a highly reliable electrical connection can be obtained. SOLUTION: A step of forming a projection electrode 3 on a connection pad 2 of a semiconductor element 1, a step of forming a recess on a surface of a connection land 7 corresponding to the arrangement of the projection electrode 3, a thermosetting adhesive 8 and a step of heating and curing the semiconductor element 1 while applying pressure to the circuit board 4 to obtain electrical and mechanical connections. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2012039108-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2012039107-A |
| priorityDate |
2002-02-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |