http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2003240819-A

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filingDate 2002-02-20-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c76d480a5c0c99f0dc57bcf7866b9f55
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publicationDate 2003-08-27-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2003240819-A
titleOfInvention Semiconductor device inspection equipment
abstract (57) Abstract: A semiconductor element inspection apparatus capable of reducing the resistance of a wiring formed through a through hole for electrically connecting both surfaces of a substrate and suppressing disconnection is realized. A double-sided connection wiring pattern 223 having a perimeter longer than a perimeter of a through-hole bottom 1131 (opening on the vertex side of a quadrangular pyramid-shaped through-hole) is penetrated on the inner surface side of the through-hole 113. It is formed in a region including a boundary portion with the hole bottom 1131, and is also formed on the surface of the silicon substrate on which the probe 111 is formed, and around the through hole bottom 1131. By forming the double-sided connection wiring pattern 223, disconnection near the through-hole bottom 1131 can be suppressed, and the wiring 2 around the through-hole bottom 131 can be prevented. 21 can be easily pulled out, and the resistance value of the wiring can be reduced.
priorityDate 2002-02-20-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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Total number of triples: 20.