http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2003240819-A
Outgoing Links
Predicate | Object |
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assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_80787665b837ed3eb503bbcd27c0043a |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R31-26 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-66 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R1-06 |
filingDate | 2002-02-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c76d480a5c0c99f0dc57bcf7866b9f55 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9aa5813db9f94043591e7270813fcaa3 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7fc22460b454d59e98fda08955c82c48 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_491291cd70b598a17223f1e2801ab080 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_59af9f163860351d1ca549dbf004f54b |
publicationDate | 2003-08-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | JP-2003240819-A |
titleOfInvention | Semiconductor device inspection equipment |
abstract | (57) Abstract: A semiconductor element inspection apparatus capable of reducing the resistance of a wiring formed through a through hole for electrically connecting both surfaces of a substrate and suppressing disconnection is realized. A double-sided connection wiring pattern 223 having a perimeter longer than a perimeter of a through-hole bottom 1131 (opening on the vertex side of a quadrangular pyramid-shaped through-hole) is penetrated on the inner surface side of the through-hole 113. It is formed in a region including a boundary portion with the hole bottom 1131, and is also formed on the surface of the silicon substrate on which the probe 111 is formed, and around the through hole bottom 1131. By forming the double-sided connection wiring pattern 223, disconnection near the through-hole bottom 1131 can be suppressed, and the wiring 2 around the through-hole bottom 131 can be prevented. 21 can be easily pulled out, and the resistance value of the wiring can be reduced. |
priorityDate | 2002-02-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 20.