| abstract |
(57) [Problem] To increase the size of a wafer, the wafer is likely to be warped. When a warped wafer is transferred by a wafer transfer mechanism in the apparatus, the wafer is transferred from the wafer transfer mechanism in the wafer transfer process. When the wafer slides down, or when the wafer is transferred from the wafer transfer mechanism onto the main chuck, the wafer cannot be received on the main chuck, or the wafer cannot be fixed on the main chuck, and the inspection cannot be performed. SOLUTION: The prober 2 of the present invention has a third and fourth evacuation passages 2 which are opened on the surface in a main chuck 26. 6C and 26D and the third and fourth evacuation passages 2 The ejectors 302F, 302F communicate with 6C, 26D, The wafer W is sucked onto the main chuck 26 by depressurizing the third and fourth vacuum exhaust passages 26C and 26D via the ejectors 302F and 302F. |