| abstract |
(57) [Summary] A mounting structure in which a temperature measuring element used for adjusting the temperature of a heat equalizing plate in a wafer heating apparatus is simply inserted into the heat equalizing plate has a problem that the measured temperature varies and the uniform heat is improved. Therefore, when the heat capacity is increased, there is a problem that the response speed of the temperature measurement becomes slow. A power supply unit having one main surface of a heat equalizing plate made of ceramics as a mounting surface for a wafer, a heating resistor on the other main surface or inside, and electrically connected to the heating resistor. In the wafer heating apparatus having the other main surface, a concave portion defining a cross-sectional area and a depth is provided on the other main surface of the heat equalizing plate, and a temperature measuring element having a predetermined wire diameter is inserted. Then, it is fixed with a filler. |