abstract |
(57) Abstract: A positive photosensitive insulating resin composition according to the present invention comprises an alkali-soluble resin (A) having a phenolic hydroxyl group, a compound (B) having a quinonediazide group, crosslinked fine particles (C), A compound (D) containing at least two or more alkyletherified amino groups in the molecule, And a solvent (E). Further, the cured product of the present invention is obtained by curing such a positive photosensitive insulating resin composition. According to the present invention, it is possible to obtain a positive type photosensitive insulating resin composition which is excellent in resolution, electric insulation, and thermal shock resistance and can obtain a cured product having good adhesion. |