| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b19eaa8e535da4e4bceed99917a68153 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-10253
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-14 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-29 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-45
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-52 |
| filingDate |
2002-01-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_fc14c36b3fd0db618ccaae0aabd697e0 |
| publicationDate |
2003-07-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2003213086-A |
| titleOfInvention |
Resin paste for semiconductor and semiconductor device |
| abstract |
(57) [Problem] To provide a highly reliable resin paste for a semiconductor that does not cause a decrease in adhesive strength during heating and does not cause peeling of the resin paste layer for a semiconductor in a solder crack resistance test after a moisture absorption treatment. SOLUTION: (A) an epoxy resin, (B) a curing agent, (C) a compound represented by the general formula (1) and (D) a filler having a filler as an essential component, and (C) a compound having a structure represented by the formula (1) in a molecule are contained in an amount of 0.1 to 100 parts by weight of the epoxy resin. It is a resin paste for semiconductors of up to 50 parts by weight. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2007111136-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2007262204-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2005059001-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101344704-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7763700-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100774059-B1 |
| priorityDate |
2002-01-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |