| abstract |
(57) [Summary] Excellent repetition bending resistance and adhesiveness used for flexible printed wiring board, cover lay material and bonding sheet which are flexible printed wiring board materials. An epoxy resin composition having heat resistance, moisture resistance and electrical reliability, and a substrate for flexible printed wiring, a coverlay material and a bonding sheet using the same. An epoxy resin (a), a curing agent (b), a phenolic hydroxyl group-containing polyamide-poly (butadiene-acrylonitrile) copolymer (c), an ion scavenger (d), and calcium carbonate (e) are contained. An epoxy resin composition characterized in that: |