| abstract |
[PROBLEMS] To provide an epoxy resin composition having a long pot life and excellent storage stability, and a semiconductor device using the same. SOLUTION: (A) an epoxy resin, (B) a phenolic resin, (C) a benzoxazine represented by the following general formula [I], (Where R 1 is a hydrogen atom or a methyl group, R 2 is an alkyl group or a phenyl group having 1 to 3 carbon atoms, n is 0 or 1 A phenolic hydroxyl group contained in the phenolic resin of component (B), which contains (D) an amine-based curing accelerator and (E) an inorganic filler as essential components. The epoxy group (equivalent ratio) of the component epoxy resin is 1. An epoxy resin composition of 5 to 4.0, and a semiconductor device using the same. |