| abstract |
(57) [Summary] An adhesive / adhesive layer capable of forming a die bond layer excellent in storage elastic modulus can be transferred to a back surface of an IC chip by smoothly performing a bonding operation to a semiconductor wafer and an IC chip pickup operation. An object of the present invention is to provide a sheet for wafer dicing and bonding. SOLUTION: The wafer dicing / adhesion sheet according to the present invention is characterized in that a first adhesive layer, a rigid layer, and a second adhesive layer are laminated on a substrate in this order. Features. The method for manufacturing a semiconductor device according to the present invention includes the steps of: adhering a semiconductor wafer to the second adhesive layer of the wafer dicing / adhering sheet; dicing the semiconductor wafer into an IC chip; A second adhesive layer, a rigid layer, and a first adhesive layer are fixedly left on the back surface and peeled off from the substrate, and the IC chip is placed on a die pad portion with the first adhesive layer. It is characterized in that thermocompression bonding is performed via |