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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31
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http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L61-06
filingDate 2002-10-21-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_05d26618b7c8c59d75275ff2dd6bff9a
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publicationDate 2003-07-22-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2003206390-A
titleOfInvention Thermosetting resin composition and cured product thereof
abstract (57) [Abstract] [Problem] High-performance molding material excellent in heat resistance, flame retardancy, etc. Dihydrobenzoxazine with improved curability without deteriorating mechanical properties, used as a raw material for paints, coating materials, adhesives, sealing materials, prepregs for printed wiring boards, metal-clad laminates, FRP, carbon products, etc. A composition of a thermosetting resin having a ring and a cured product thereof are provided. A thermosetting resin composition containing 5 to 30% by weight of a thermosetting resin having a dihydrobenzoxazine ring and 70 to 95% by weight of a novolak type phenol resin.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8227390-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2012001709-A
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type http://data.epo.org/linked-data/def/patent/Publication

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