http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2003204007-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_7ef01e33058cf740cf2197991be97af1 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48247 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48091 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73265 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-68 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-62 |
| filingDate | 2002-06-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_670525c901222e84f769fe8d1366e393 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_46b580f0ef9af604617c279f870cb50a http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_24266dfa41182bfb37aecd32028722f8 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_887c02ee12d0d7f5da3f388d3e9c9c9c http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_68fb57033085daca6c15a5d9177cb43c |
| publicationDate | 2003-07-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2003204007-A |
| titleOfInvention | Molded circuit board, hollow package for housing semiconductor device, and semiconductor device using the package |
| abstract | PROBLEM TO BE SOLVED: To provide a molded circuit board having a low dielectric loss tangent in a high frequency region obtained from an epoxy resin, a hollow package for accommodating a semiconductor element, and a semiconductor element using the package. SOLUTION: A phosphine oxide compound represented by the general formula (1) as a curing accelerator, and a bifunctional or more functional compound in which 10 mol% to 100 mol% of hydroxyl groups are esterified with an aromatic or aliphatic carboxylic acid as a curing agent. A molded circuit board, a hollow package for accommodating a semiconductor element, and a semiconductor element using the same obtained by using an epoxy resin composition containing an ester-containing compound or an ester-containing resin. Embedded image (In the formula, R 1 to R 6 are a hydrogen atom, a C1-10 alkyl group, or a C6-10 aryl group or aralkyl group.) |
| priorityDate | 2001-10-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 114.