| abstract |
(57) [Summary] [PROBLEMS] To firmly bond a wafer to be mounted via a gasket. SOLUTION: The gasket 201 is a cup wafer 20. 3 includes a hermetically sealed environment 211 between the base wafer 207. The gasket 201 bonds the base wafer 207 using the bonding material 209. The bonding material 209 can be one or more materials that provide acceptable adhesion, sealing power, sealing, and other properties that ensure a sealed environment. The gasket 201 is shaved from the material of the cup wafer itself. The cup wafer 203 is typically formed from a very strong and rigid material such as silicon. Since the gasket 201 is formed from the cup wafer 203, the gasket 201 itself is also very strong and rigid. |