abstract |
[PROBLEMS] To develop heat resistance, moisture resistance, dielectric performance, and flame retardancy required for electrical or electronic component materials such as semiconductor sealing materials and circuit board varnishes. A novel epoxy resin having an aromatic polycyclic skeleton represented by the following structural formula is used as a main component of an epoxy resin composition used for semiconductor sealing materials, circuit board varnishes, and the like. [Chemical 1] |