| abstract |
PROBLEM TO BE SOLVED: To provide a polyimide resin composition solution capable of forming a film at a low temperature, and a film adhesive using the same, which can be bonded in a short time at a low temperature and has excellent adhesive strength. To do. SOLUTION: A polyimide resin obtained by polymerizing an aromatic tetracarboxylic dianhydride, a diaminopolysiloxane, and an aromatic diamine or an aliphatic diamine in a reaction solvent comprising phenyl ether and an azeotropic solvent. A polyimide resin composition solution comprising a solution (A), an epoxy compound (B), a silane coupling agent (C), and a cyanate compound (D). |