http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2003192766-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b19eaa8e535da4e4bceed99917a68153 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-62 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 |
| filingDate | 2001-12-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a39ef7424ff721b11dda09a52a5f8a1b |
| publicationDate | 2003-07-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2003192766-A |
| titleOfInvention | Epoxy resin composition for semiconductor encapsulation and semiconductor device |
| abstract | (57) [Problem] To provide an epoxy resin composition which does not contain a bromine-containing organic compound and an antimony compound, and has excellent adhesion to a substrate, flame retardancy, and solder stress resistance. (A) an epoxy resin represented by the general formula (1), (B) a phenol resin represented by the general formula (2), (C) an inorganic filler, (D) a curing accelerator, and (E) N- An epoxy resin composition for encapsulating a semiconductor, comprising oxydiethylene-2-benzothiazolylsulfanamide as an essential component, wherein the total amount of inorganic substances is 84% by weight or more and 94% by weight or less in the total epoxy resin composition. . Embedded image Embedded image |
| priorityDate | 2001-12-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 38.