| abstract |
(57) [Summary] (With correction) [PROBLEMS] To prevent both wire bonding failure and mold flash when used in the manufacture of a semiconductor device such as QFN, and to prevent defective semiconductor devices. An adhesive sheet for manufacturing a semiconductor device is provided. An adhesive sheet for manufacturing a semiconductor device according to the present invention is an adhesive sheet for manufacturing a semiconductor device that includes an adhesive layer on one surface of a heat-resistant substrate and is detachably attached to a lead frame. The adhesive layer contains a thermoplastic polyimide resin, and the elastic modulus of the adhesive layer at 150 to 250 ° C. is 1 MPa or more. |