http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2003183841-A

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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-28
filingDate 2001-12-14-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_aedafff80470223e96b7a8c8bfcc6ee8
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publicationDate 2003-07-03-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2003183841-A
titleOfInvention Pretreatment method for electroless plating material
abstract (57) [Problem] To form a plating film having excellent adhesion without roughening a resin material. An ozone treatment for bringing a solution containing ozone into contact with a resin material having an unsaturated bond is performed, then a stabilization treatment for stabilizing the surface of the resin material after the ozone treatment is performed, and then an electroless plating treatment is performed. It is considered that the unstable ozonide on the surface of the resin material is decomposed by the stabilization treatment to generate a methylol group or a carbonyl group, and the plating film exhibits high adhesion immediately after the electroless plating treatment.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2022136377-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2011127155-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2013253324-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2008291288-A
priorityDate 2001-12-14-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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