http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2003183616-A
Outgoing Links
Predicate | Object |
---|---|
assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_47cc435e1d443f13180f7766df104d9d |
classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002 |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J201-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-373 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J11-00 |
filingDate | 2001-12-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1122d399eb19121cf42ceb8b731b6620 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_03e454046dd9b10195497b018920e434 |
publicationDate | 2003-07-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | JP-2003183616-A |
titleOfInvention | Method for producing adhesive paste and adhesive paste using the same |
abstract | PROBLEM TO BE SOLVED: To provide an inexpensive adhesive paste that has excellent thermal conductivity after adhesive curing and has a high adhesive layer and ensures the reliability of a semiconductor device, while practically satisfying the bonding strength of the adhesive paste. I do. SOLUTION: (1) a step of uniformly mixing a metal ion source and an organic compound having a functional group capable of coordinating to a metal ion, and (2) a step of reducing the metal ion source to form a metal fine particle mixture. And (3) a step of mixing an adhesive component with the metal fine particle mixture. |
isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2012156249-A |
priorityDate | 2001-12-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 61.