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filingDate 2001-12-14-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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publicationDate 2003-07-03-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2003183616-A
titleOfInvention Method for producing adhesive paste and adhesive paste using the same
abstract PROBLEM TO BE SOLVED: To provide an inexpensive adhesive paste that has excellent thermal conductivity after adhesive curing and has a high adhesive layer and ensures the reliability of a semiconductor device, while practically satisfying the bonding strength of the adhesive paste. I do. SOLUTION: (1) a step of uniformly mixing a metal ion source and an organic compound having a functional group capable of coordinating to a metal ion, and (2) a step of reducing the metal ion source to form a metal fine particle mixture. And (3) a step of mixing an adhesive component with the metal fine particle mixture.
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