| abstract |
(57) Abstract: (a) a liquid epoxy resin, (b) a curing agent, (c) a curing accelerator, and (d) one or more selected from abietic acid and its derivatives as essential components. A liquid epoxy resin composition containing component (d) in an amount of 0.5 to 5 parts by weight based on 100 parts by weight of the total of components (a) and (b); Sealed and thermoset flip-chip type semiconductor device. The liquid epoxy resin composition of the present invention has no voids, has excellent adhesion to the surface of a silicon chip, and has a high temperature even when cured at the same time as solder connection when connecting a semiconductor element to a substrate. It does not deteriorate even under humid conditions and is excellent in thermal shock. A semiconductor device using this sealing material is very reliable. |