| abstract |
(57) [Summary] [PROBLEMS] High transmittance in the near-ultraviolet to visible wavelength range, long-term thermal stability, oxidation stability and ultraviolet stability, heat with other materials for encapsulating solid-state devices Provided is a packaging material for a solid-state device having properties such as chemical compliance, low coloration and high reflectance. Means for Solving the Problems (A) One or more kinds of alicyclic epoxy resins, (B) a curing agent comprising hexahydro-4-methylphthalic anhydride, (C) one kind substantially containing no halogen An epoxy resin composition comprising the above-mentioned boron-containing catalyst and (D) one or more curing regulators. Encapsulant (11) May contain one or more of a heat stabilizer, an ultraviolet stabilizer, a coupling agent, and a refractive index adjuster. package, Also provided is a packaged solid state device comprising a chip (4) and an encapsulant (11) comprising the epoxy resin composition of the present invention. A method for encapsulating a solid state device is also provided. |