| abstract |
PROBLEM TO BE SOLVED: To provide a semiconductor wafer polishing step in which a semiconductor wafer is firmly adhered to a surface opposite to a surface to be polished to protect the semiconductor wafer and easily peeled off after polishing. And a method for polishing a semiconductor wafer using the same. In a polishing process for a semiconductor wafer, a back grinding tape for protecting a surface opposite to a surface to be polished, wherein a pressure-sensitive adhesive layer is formed on one surface of a base material. Backgrinding tape containing a gas generating agent in which the agent layer generates gas by applying a stimulus. |