| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_3a8a9c815fc8478d3e08d53d4dd6cd87
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_294881271413951a95f284b588a68e66 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02052 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76802
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-423
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-42
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-425
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-422 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-306 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-42
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-027
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-768 |
| filingDate |
2001-12-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_313057ab3383c0f17ab11e4bb7f7eaa8
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f8612e65c06ea94c8dce9441413aaece
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4a63e76db7c78dae027d2358bcff200a
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d72eeb7977d1de44b9a5294ecf2df101
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_87647053e0820a30ec22508f43421f80 |
| publicationDate |
2003-06-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2003173033-A |
| titleOfInvention |
Resist stripping composition and method of manufacturing semiconductor device using the same |
| abstract |
(57) [Abstract] [PROBLEMS] To ensure that resist and polymer residues can be peeled off and removed, and to minimize damage to wiring. SOLUTION: After a metal film or a semiconductor film on a semiconductor substrate is dry-etched to form a wiring layer having a predetermined pattern, or an insulating layer is formed on the semiconductor substrate on which the wiring layer is formed, and After dry etching into a predetermined pattern, a chemical treatment is carried out with a resist stripping composition containing a fluorine compound, an organic solvent and water and added with a sugar alcohol. The pH of the resist stripping composition is 8 or more. For example, xylitol is used as the sugar alcohol. |
| priorityDate |
2001-12-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |