| abstract |
(57) [Problem] To provide an epoxy resin composition having excellent storage stability and moldability, high adhesive strength and low hygroscopicity, and generating a small amount of free halogen when heated at a high temperature. A biphenyl-type epoxy resin having two or more epoxy groups and a biphenyl skeleton per molecule, a polycondensate of a phenol having at least two hydroxyl groups per molecule and an aralkyl ether, and an organic boron compound of an organic phosphine compound are provided. An epoxy resin composition containing a salt. |