http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2003155362-A

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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08J5-24
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filingDate 2001-11-19-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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publicationDate 2003-05-27-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2003155362-A
titleOfInvention Thermosetting resin prepreg, method for producing the same, laminate for electric wiring board, and multilayer printed wiring board
abstract (57) [Summary] [Problem] A thermosetting resin with small amount of dimensional shrinkage in the manufacturing and use process of printed wiring boards, dimensional shrinkage difference (anisotropic) between vertical and horizontal directions due to dimensional shrinkage, small dimensional shrinkage variation A prepreg and a method for producing the prepreg are provided. SOLUTION: While transferring a glass cloth substrate, the glass cloth substrate is continuously impregnated with a thermosetting resin varnish, dried and semi-cured, and then the thermosetting resin remains semi-cured in a state where tension does not act. And a method for producing a thermosetting resin prepreg, which is heat-treated in a temperature range of 90 to 140C.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-WO2010098037-A1
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Total number of triples: 24.