http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2003147302-A
Outgoing Links
Predicate | Object |
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assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b19eaa8e535da4e4bceed99917a68153 |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J7-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J4-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J201-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L55-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-301 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L23-10 |
filingDate | 2001-11-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c815fe038d4139c7ee1f421780f235ce http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_02f6bc56717d45f03b4c9ee7fb93fae3 |
publicationDate | 2003-05-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | JP-2003147302-A |
titleOfInvention | Adhesive sheet for semiconductor substrate processing |
abstract | PROBLEM TO BE SOLVED: To provide a pressure-sensitive adhesive sheet for semiconductor processing capable of preventing generation of electrification in a semiconductor manufacturing process, and preventing destruction and deterioration of a semiconductor device due to the electrification. SOLUTION: For 100 parts by weight of polypropylene, On a resin film substrate surface added with 10 to 200 parts by weight of an antistatic agent obtained by copolymerizing a polyoxyethylene chain and butadiene, an adhesive comprising a base polymer, a radiation polymerizable compound and a radiation polymerizable polymerization initiator is coated An adhesive sheet for processing a semiconductor substrate, which is applied to form an adhesive layer. |
isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2005225068-A |
priorityDate | 2001-11-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 75.