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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J7-02
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filingDate 2001-11-15-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c815fe038d4139c7ee1f421780f235ce
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publicationDate 2003-05-21-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2003147302-A
titleOfInvention Adhesive sheet for semiconductor substrate processing
abstract PROBLEM TO BE SOLVED: To provide a pressure-sensitive adhesive sheet for semiconductor processing capable of preventing generation of electrification in a semiconductor manufacturing process, and preventing destruction and deterioration of a semiconductor device due to the electrification. SOLUTION: For 100 parts by weight of polypropylene, On a resin film substrate surface added with 10 to 200 parts by weight of an antistatic agent obtained by copolymerizing a polyoxyethylene chain and butadiene, an adhesive comprising a base polymer, a radiation polymerizable compound and a radiation polymerizable polymerization initiator is coated An adhesive sheet for processing a semiconductor substrate, which is applied to form an adhesive layer.
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type http://data.epo.org/linked-data/def/patent/Publication

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