| abstract |
(57) [Problem] To provide a surface protection sheet which can maintain a constant kerf width during or after back surface grinding in a so-called pre-dicing method and can easily attach a peeling tape, and a method of using the same. SOLUTION: The surface protection sheet according to the present invention at the time of grinding the back surface of a wafer, forms a groove with a depth of cut smaller than the thickness of the wafer from the surface of the wafer on which the semiconductor circuit is formed, and then grinds the back surface of the semiconductor wafer. The surface protection sheet of the semiconductor wafer used in the backside grinding of the wafer to reduce the thickness of the wafer and eventually divide the wafer into individual chips. The base material has two or more constituent layers, the thickness of the first constituent layer is 10 to 300 μm, and the Young's modulus is 3000 to 30000 N / m 2 , The glass transition point of the second constituent layer measured by DSC is 70 ° C. or lower, and the second constituent layer is formed as the outermost layer. |