| abstract |
PROBLEM TO BE SOLVED: To provide an epoxy resin for semiconductor encapsulation which does not contain a halogen-based flame retardant and an antimony compound and has excellent moldability, flame retardancy, solder resistance, moisture resistance reliability, and high-temperature storage characteristics. Providing a composition. SOLUTION: (A) an epoxy resin, (B) a phenol resin, (C) a curing accelerator comprising an adduct of triphenylphosphine and 1,4-benzoquinone, (D) an inorganic filler, and (E) a phosphazene compound. An epoxy resin composition for encapsulating a semiconductor, comprising: |