| abstract |
(57) [Problem] To provide an optical semiconductor element such as an interline type CCD or CMOS sensor and to form a semiconductor element in a hollow structure package when a resin layer cannot be formed on the semiconductor element surface. There were issues that had to be done. SOLUTION: In the semiconductor device of the present invention, the insulating resin 23 is provided. First and second conductive wiring portions 24 and 25 are formed in the upper and lower portions, and a semiconductor element 28 is fixed on an insulating resin sheet 22 having a multilayer structure. Connection. The semiconductor element 28 and the like realize a hollow structure by being located in the concave portion 34 including the frame portion 35, the glass plate 36, and the like. Further, a transparent resin capable of obtaining a desired light spectral characteristic is applied to the entire surface of the glass plate 36, and the versatility can be improved by various transparent resins. |