http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2003133375-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_80787665b837ed3eb503bbcd27c0043a |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2223-54473 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-544 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-544 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R1-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-66 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R31-26 |
| filingDate | 2001-10-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_59af9f163860351d1ca549dbf004f54b http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_491291cd70b598a17223f1e2801ab080 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e236c23d83ba5709c301dc272d8bd750 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7fc22460b454d59e98fda08955c82c48 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9aa5813db9f94043591e7270813fcaa3 |
| publicationDate | 2003-05-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2003133375-A |
| titleOfInvention | Semiconductor device manufacturing method and semiconductor device |
| abstract | (57) Abstract: In an electrical characteristic inspection of a semiconductor device, for example, an efficient inspection step of contacting a probe with an electrode pad formed at a narrow pitch of an inspection semiconductor element with high reliability is provided. Provided are a method for manufacturing a semiconductor device and a semiconductor device capable of efficiently manufacturing a semiconductor device. A method for manufacturing a semiconductor device, comprising: a forming step of forming a semiconductor element on a semiconductor wafer; and an inspecting step of inspecting electrical performance of the formed semiconductor element. The inspection step includes a step of electrically connecting the inspection device to an electrode pad formed on the semiconductor device to be inspected, and forming a probe including a plurality of beams having probes electrically connected to the electrode pad. A first beam having a probe electrically connected to at least one of the electrode pads, and a number greater than the number of electrode pads electrically connected to the first beam. And a second beam having a number of probes that can be electrically connected to the electrode pad. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2008518228-A |
| priorityDate | 2001-10-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
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|---|---|
| isDiscussedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID426812071 http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID18526942 |
Total number of triples: 23.