http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2003129247-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c1755eede76ea7e719a3e0d2843cd793 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-40 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08J7-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-28 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-16 |
| filingDate | 2001-10-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_df8859878e7593713834bb43c6a74b30 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a6a776556012d9327d6e5baac6942508 |
| publicationDate | 2003-05-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2003129247-A |
| titleOfInvention | Method for forming conductive film and conductive circuit pattern on resin surface |
| abstract | An object of the present invention is to provide a method for efficiently and easily forming a conductive circuit pattern by adsorbing metal ions only on a required portion of a target resin surface. SOLUTION: A method for forming a conductive film on a resin surface, which comprises performing at least the following five steps (1) to (4) in this order: (1) a carboxyl group and / or a sulfonyl on a target resin surface; A step of forming a negative type resist layer having a group, (2) ion exchange between a carboxyl group and / or a sulfonyl group of the uncured portion remaining on the circuit pattern and a metal ion from a metal salt to form a negative resist layer on the surface of the target resin. A step of generating a metal salt of a carboxyl group and / or a sulfonyl group, (3) a step of reducing the metal salt of a carboxyl group and / or a sulfonyl group, and forming a metal coating on the surface of a target resin; A step of applying electroless plating and / or electrolytic plating on the coating to form a conductive coating or a conductive circuit pattern on the surface of the target resin. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7604835-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-100393784-C http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100906317-B1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2008023666-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2010532429-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2018071939-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2005223063-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100755192-B1 |
| priorityDate | 2001-10-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 67.