http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2003129025-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b19eaa8e535da4e4bceed99917a68153 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-29 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J179-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G73-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-301 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J183-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J7-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J4-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-52 |
| filingDate | 2001-10-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d79eccfcd34c42cf4247a1314f9be4ae |
| publicationDate | 2003-05-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2003129025-A |
| titleOfInvention | Die attach film, method of manufacturing semiconductor device using the same, and semiconductor device |
| abstract | PROBLEM TO BE SOLVED: To provide an adhesive sheet exhibiting excellent expandability and excellent chipping resistance in a wafer processing step in order to simplify the process and reduce costs in a semiconductor assembling step, and to provide an IC chip bonding step. And a semiconductor device and a semiconductor device using the same. SOLUTION: In ultraviolet light of 370 nm or less, 60 % Is a die attach film comprising an adhesive layer having an absorptivity of not less than 10% and a light-transmitting substrate, and preferably contains a resin component having an imide ring as an adhesive component. A die attach film characterized by having the adhesiveness required for the wafer processing process, the adhesiveness at the time of die mounting, and the adhesiveness to withstand wet heat conditions by combining a curable adhesive component and an ultraviolet curable adhesive component. . |
| priorityDate | 2001-10-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 145.