| abstract |
(57) [Summary] [Problem] Even if a large amount of fine silica powder is contained in order to reduce the coefficient of thermal expansion of a cured silicone, an increase in viscosity due to thixotropy is suppressed, and good fluidity and impregnation properties are obtained. Provided is a curable liquid silicone composition having the same, and a semiconductor device having a semiconductor element coated with the composition and having excellent reliability. A curable liquid silicone composition containing fine silica powder, wherein the ratio of the content of isolated silanol groups to the content of internal silanol groups in the fine silica powder is 0.01 or more. A curable liquid silicone composition, and a semiconductor device comprising a semiconductor element coated with the composition. |