http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2003128761-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b19eaa8e535da4e4bceed99917a68153 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-62 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-00 |
| filingDate | 2001-10-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b2966cd4714a8deeee873ec64b22cd2d |
| publicationDate | 2003-05-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2003128761-A |
| titleOfInvention | Epoxy resin composition and semiconductor device |
| abstract | (57) [Problem] To provide an epoxy resin composition for semiconductor encapsulation having characteristics excellent in releasability and reliability. SOLUTION: (A) Epoxy resin, (B) phenolic resin, (C) inorganic filler, (D) curing accelerator, and (E) A semiconductor characterized in that the epoxy resin composition containing the compound represented by the general formula (1) as an essential component contains the compound represented by the general formula (1) in an amount of 0.01 to 3% by weight of the total epoxy resin composition. Epoxy resin composition for sealing. Embedded image (R 1 to R 5 are an alkyl group having 1 to 4 carbon atoms or hydrogen) |
| priorityDate | 2001-10-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 47.