| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_e5db580deca7130dbe51805c6c608b35 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01327
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01322
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01029
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13109
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01006
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01005 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-60 |
| filingDate |
2002-09-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1e5a0ffe83a47e44faafb9a9a0d9a87f
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3fc0e89374d7d624328c7b9090640610 |
| publicationDate |
2003-04-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2003124250-A |
| titleOfInvention |
Bonding method and conductive circuit structure |
| abstract |
(57) Abstract: Provided is a bonding method including a step of applying a dielectric layer (preferably a bonding sheet) on a circuit forming layer having a conductive region. An aperture is formed in a dielectric layer over a conductive region. A conductive body disposed on another circuit forming substrate is inserted into the aperture. The conductive body comprises a main region (eg, a conductive post) and a depletion region (eg, a thin layer of metal or a transient liquid metal bonding material). The depletion regions are in contact with conductive regions on the circuit formation layers, and these circuit formation layers are stacked together. Heat and pressure are applied to the combination to form an intermetallic region from the depletion region. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9397063-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11710718-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9030001-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2012500494-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2013008977-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9633971-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10535626-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2012114470-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2014090183-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-102142418-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10886250-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9496236-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9818713-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10892246-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2007110095-A |
| priorityDate |
2001-09-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |