http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2003119252-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b19eaa8e535da4e4bceed99917a68153 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-62 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 |
| filingDate | 2001-10-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8d9b1d07539bd2c96d9e1712e53cd745 |
| publicationDate | 2003-04-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2003119252-A |
| titleOfInvention | Epoxy resin composition and semiconductor device |
| abstract | (57) [Problem] To provide an epoxy resin composition for semiconductor encapsulation excellent in flame retardancy, moldability, and solder crack resistance without using a large amount of conventional flame retardants. (A) an epoxy resin represented by the general formula (1), (B) an epoxy resin represented by the general formula (2), (C) a phenolic resin represented by the general formula (3), (D) A phenolic resin represented by the general formula (4), (E) a curing accelerator, and (F) an inorganic filler are essential components, and a weight ratio of (A) to (B) [(A) / (B)] Is 1 to 10 and the weight ratio of (C) to (D) [(C) / (D)] is 1 to 10. An epoxy resin composition for semiconductor encapsulation, wherein |
| priorityDate | 2001-10-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 32.