| abstract |
(57) Abstract: The present invention is excellent in photosensitivity and developability, and has excellent cured product flexibility, solder heat resistance, heat deterioration resistance, and electroless gold plating resistance, and is used for a solder resist and an interlayer insulating layer. It is an object of the present invention to provide a resin composition particularly suitable for use. The resin composition of the present invention comprises the following (a) to It is characterized by containing an oligomer (A) obtained by reacting the component (d). (A) an epoxy resin having at least two epoxy groups in one molecule; (b) a compound having two hydroxyl groups and one carboxyl group in one molecule; (c) a carboxy group-containing rubbery polymer (d) Monobasic acid containing unsaturated group |