http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2003115652-A

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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-18
filingDate 2001-10-03-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_df8859878e7593713834bb43c6a74b30
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a6a776556012d9327d6e5baac6942508
publicationDate 2003-04-18-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2003115652-A
titleOfInvention Method for forming conductive film and conductive circuit pattern on resin surface
abstract (57) [Problem] To provide a method for efficiently and easily forming a conductive film or a conductive circuit pattern by adsorbing metal ions only to a required portion of a target resin surface. SOLUTION: A method for forming a conductive film or a conductive circuit pattern on a resin surface, which is performed through at least the following five steps in this order: (1) Carboxyl when ionizing radiation is irradiated on the target resin surface Forming a positive resist layer that generates a group or a sulfonyl group; (2) irradiating the positive resist layer with ionizing radiation directly or through a mask pattern to generate a carboxyl group or a sulfonyl group on the surface of the target resin. (3) a step of forming a metal salt of a carboxyl group or a sulfonyl group on the surface of the target resin by ion exchange between the carboxyl group or the sulfonyl group and a metal ion from a metal salt; To reduce the metal salt of A step of forming a metal film on the surface of the target resin, and (5) a step of forming a conductive film or a conductive circuit pattern on the surface of the target resin by performing electroless plating and / or electrolytic plating on the metal film.
priorityDate 2001-10-03-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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