http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2003114529-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_06836496fbb35de4839e8a82a3cd8963 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-027 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F220-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F220-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F220-28 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-40 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-004 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-022 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-033 |
| filingDate | 2001-10-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1d84af3086bc8309b2f588cfd22a1a07 |
| publicationDate | 2003-04-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2003114529-A |
| titleOfInvention | Positive photosensitive resin composition |
| abstract | (57) [Summary] [PROBLEMS] To be developed with an alkaline aqueous solution and have high sensitivity Moreover, a photosensitive resin composition capable of easily forming a patterned thin film having excellent properties such as high resolution, developability, heat resistance, chemical resistance, adhesion to a substrate, transparency, and insulation. And a photosensitive resin composition capable of easily forming a patterned thin film having excellent low dielectric properties simultaneously with the above-mentioned various properties, and a pattern forming method using the same. An alkali-soluble resin comprising a copolymer having benzyl (meth) acrylate, acrylic acid or methacrylic acid, and a hydroxyalkyl ester as constituent units, a compound containing a 1,2-naphthoquinonediazide group, and a crosslinking agent are provided. A positive photosensitive resin composition comprising: Applying the positive photosensitive resin composition, In the step of sequentially performing exposure, development, second exposure, and heat treatment, the amount of second exposure is 0.5 to 15 times that of the first exposure. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2005096100-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-108572516-B http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2007052359-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-108572516-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-110275391-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-113929810-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-102433199-B1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101342521-B1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20180103405-A |
| priorityDate | 2001-10-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 333.